1. Chinese handheld teaching pendant operation, convenient programming, easy to learn and understand
2. Capable of drawing points, lines, surfaces, arcs, circles, and irregular curves for continuous interpolation, achieving any 3D non planar trajectory path
3. Supports advanced features such as array, graphical browsing, 3D ellipses, common graphic library insertion, and group editing
4. The glue quantity, thickness, coating speed, dispensing time, and stopping time can all be parameterized
5. Stable glue output, clean glue breakage, and no leakage of glue
6. Automatic anti curing function, effectively preventing glue from solidifying and blocking the needle tip
7. Equipped with glue preheating function, greatly reducing the time for changing glue
Usage: Adhesive, pouring, coating, sealing, filling, drip, linear/curved/circular coating in product technology.
Technical parameters:
Scope of work |
X/Y /Z(mm):400/400/100(mm) |
Maximum load |
Y / Z:5KG/3KG |
Maximum speed |
500mm/S |
XYZ positioning accuracy Repetitive accuracy |
±0.02~±0.05(mm) |
External dimensions |
620(L)×680 (W) ×600(H)mm |
Machine weight |
Approximately 45KG |
Program storage capacity |
999 parameter files (65535 points per file) |
operating system |
LCD panel/handheld programmer |
Motor system |
Leisai stepper motor |
Sports mode |
3-axis point-to-point, continuous straight line, circular arc |
Shaft transmission mode |
Motor+synchronous belt+precision linear guide rail |
control system |
Control card |
Input power supply |
AC220V |
Working environment temperature |
5~40℃ |
Working environment humidity |
20~90% |
Application scope:
Sensors, relays, power adapters, electronic toys, electronic components, household appliances, electric vehicle controllers, computer digital products, coil products, button products, battery boxes, speaker outer ring adhesive bonding; Speaker packaging and dispensing, semiconductor, mobile phone battery, laptop battery packaging, PCB board bonding adhesive, COB, IC, PDA, LCD sealing, IC packaging, chassis bonding, optical device processing, hardware component packaging and coating, quantitative liquid filling, chip bonding, automotive mechanical component coating, mechanical sealing, etc.
Applicable scope:
The hot melt glue dispensing machine is suitable for dispensing granular hot melt glue or 30CC needle hot melt glue on relays, sensors, phone boards, electronic toy products, electronic components, electronic coils, power adapters, speaker outer rings, PCB boards, handicrafts, etc